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july 2008 rev 1 1/19 19 stb3n62k3, std3n62k3, stf3n62k3 STP3N62K3, stu3n62k3 n-channel 620 v, 2.2 ? , 2.7 a supermesh3? power mosfet d 2 pak, dpak, to-220fp, to-220, ipak features 100% avalanche tested extremely high dv/dt capability very low intrinsic capacitances improved diode reverse recovery characteristics zener-protected application switching applications description the new supermesh3? series is obtained through the combination of a further fine tuning of st's well established strip-based powermesh? layout with a new optimization of the vertical structure. in addition to reducing on-resistance significantly versus previous generation, special attention has been taken to ensure a very good dv/dt capability and higher margin in breakdown voltage for the most demanding application. figure 1. internal schematic diagram type v dss r ds(on) max i d pw stb3n62k3 std3n62k3 stf3n62k3 STP3N62K3 stu3n62k3 620 v 620 v 620 v 620 v 620 v < 2.5 ? < 2.5 ? < 2.5 ? < 2.5 ? < 2.5 ? 2.7 a 2.7 a 2.7 a (1) 2.7 a 2.7 a 1. limited by package 45 w 45 w 20 w 45 w 45 w 3 2 1 1 2 3 1 3 to-220 dpak to-220fp ipak 1 2 3 1 3 d2pak table 1. device summary order codes marking package packaging stb3n62k3 6n62k3 d2pak tape and reel std3n62k3 6n62k3 dpak tape and reel stf3n62k3 6n62k3 to-220fp tube STP3N62K3 6n62k3 to-220 tube stu3n62k3 6n62k3 ipak tube www.st.com
contents stb/d/f/p/u3n62k3 2/19 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
stb/d/f/p/u3n62k3 electrical ratings 3/19 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit to-220 d2pak dpak ipak to-220fp v ds drain-source voltage (v gs = 0) 620 v v gs gate- source voltage 30 v i d drain current (continuous) at t c = 25 c 2.7 2.7 (1) 1. limited by package a i d drain current (continuous) at t c = 100 c 1.7 1.7 (1) a i dm (2) 2. pulse width limited by safe operating area drain current (pulsed) 10.8 10.8 (1) a p tot total dissipation at t c = 25 c 45 20 w derating factor 0.36 0.16 w/c v esd(g-s) gate source esd (hbm-c = 100 pf, r = 1.5 k ?) 2500 v dv/dt (3) 3. i sd 2.7 a, di/dt 200 a/s, v dd = 80% v (br)dss peak diode recovery voltage slope 9 v/ns v iso insulation withstand voltage (rms) from all three leads to external heat sink (t = 1 s; t c = 25 c) -- 2500 v t stg storage temperature -55 to 150 c t j max. operating junction temperature 150 c table 3. thermal data symbol parameter to-220 d2pak dpak ipak to-220fp unit r thj-case thermal resistance junction-case max 2.78 6.25 c/w r thj-pcb thermal resistance junction-pcb max -- 50 -- -- c/w r thj-amb thermal resistance junction-amb max 62.5 100 62.5 c/w t l maximum lead temperature for soldering purpose 300 c table 4. avalanche characteristics symbol parameter m ax value unit i ar avalanche current, repetitive or not-repetitive (pulse width limited by t j max) 2.7 a e as single pulse avalanche energy (starting t j = 25 c, i d = i ar , v dd = 50 v) 100 mj
electrical characterist ics stb/d/f/p/u3n62k3 4/19 2 electrical characteristics (t c = 25 c unless otherwise specified) table 5. on /off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage i d = 1 ma, v gs = 0 620 v i dss zero gate voltage drain current (v gs = 0) v ds = max rating v ds = max rating, t c =125 c 1 50 a a i gss gate-body leakage current (v ds = 0) v gs = 20 v 10 a v gs(th) gate threshold voltage v ds = v gs , i d = 50 a 3 3.75 4.5 v r ds(on static drain-source on resistance v gs = 10 v, i d = 1.4 a 2.2 2.5 ? table 6. dynamic symbol parameter test conditions min. typ. max. unit g fs (1) forward transconductance v ds = 15 v, i d = 1.4 a 2.1 s c iss c oss c rss input capacitance output capacitance reverse transfer capacitance v ds = 25 v, f = 1 mhz, v gs = 0 385 55 6 pf pf pf c oss eq (1) 1. c oss eq . is defined as a constant equivalent capacitance giving the same charging time as c oss when v d s increases from 0 to 80% v dss equivalent output capacitance v gs = 0, v ds = 0 to 496 v 32.3 pf r g intrinsic gate resistance f = 1 mhz open drain 10 ? q g q gs q gd total gate charge gate-source charge gate-drain charge v dd = 496 v, i d = 2.7 a, v gs = 10 v (see figure 17 ) 13 2.5 7.5 nc nc nc table 7. switching times symbol parameter test conditions min. typ. max unit t d(on) t r t d(off) t f turn-on delay time rise time turn-off-delay time fall time v dd = 310 v, i d =1.7 a, r g = 4.7 ?, v gs = 10 v (see figure 16 ) 9 6.8 22 15.6 ns ns ns ns
stb/d/f/p/u3n62k3 electrical characteristics 5/19 table 8. source drain diode symbol parameter test conditions min. typ. max. unit i sd i sdm (1) 1. pulse width limited by safe operating area source-drain current source-drain current (pulsed) 2.7 10.8 a a v sd (2) 2. pulsed: pulse duration = 300 s, duty cycle 1.5% forward on voltage i sd = 2.7 a, v gs = 0 1.6 v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 2.7 a, di/dt = 100 a/s v dd = 60 v (see figure 21 ) 190 825 9 ns nc a t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i sd = 2.7 a, di/dt = 100 a/s v dd = 60 v, t j = 150 c (see figure 21 ) 255 1100 10 ns nc a table 9. gate-source zener diode symbol parameter test conditions min typ max unit bv gso (1) 1. the built-in back-to-back zener diodes have specif ically been designed to enhanc e not only the device?s esd capability, but also to make th em safely absorb possible voltage tr ansients that may occasionally be applied from gate to source. in this respect the zener voltage is appropriate to achieve an efficient and cost-effective intervention to protec t the device?s integrity. these int egrated zener diodes thus avoid the usage of external components gate-source breakdown voltage igs= 1 ma (open drain) 30 v
electrical characterist ics stb/d/f/p/u3n62k3 6/19 2.1 electrical characteristics (curves) figure 2. safe operating area for to-220, ipak, dpak, d2pak figure 3. thermal impedance for to-220, ipak, dpak, d2pak figure 4. safe operating area for to-220fp figure 5. thermal impedance for to-220fp figure 6. output characteristics figure 7. transfer characteristics
stb/d/f/p/u3n62k3 electrical characteristics 7/19 figure 8. normalized bv dss vs temperature figure 9. static drain-source on resistance figure 10. gate charge vs gate-source voltage figure 11. capacitance variations figure 12. normalized gate threshold voltage vs temperature figure 13. normalized on resistance vs temperature
electrical characterist ics stb/d/f/p/u3n62k3 8/19 figure 14. source-drain diode forward characteristics figure 15. maximum avalanche energy vs temperature
stb/d/f/p/u3n62k3 test circuits 9/19 3 test circuits figure 16. switching times test circuit for resistive load figure 17. gate charge test circuit figure 18. test circuit for inductive load switching and diode recovery times figure 19. unclamped inductive load test circuit figure 20. unclamped inductive wavefo rm figure 21. switching time waveform
package mechanical data stb/d/f/p/u3n62k3 10/19 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
stb/d/f/p/u3n62k3 package mechanical data 11/19 to-220 mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 b 0.61 0. 88 0.024 0.0 3 4 b 1 1.14 1.70 0.044 0.066 c0.4 8 0.70 0.01 9 0.027 d 15.25 15.75 0.6 0.62 d1 1.27 0.050 e 10 10.40 0. 393 0.40 9 e 2.40 2.70 0.0 9 4 0.106 e1 4. 9 5 5.15 0.1 9 4 0.202 f1.2 3 1. 3 2 0.04 8 0.051 h1 6.20 6.60 0.244 0.256 j1 2.40 2.72 0.0 9 4 0.107 l1 3 14 0.511 0.551 l1 3 .50 3 . 93 0.1 3 7 0.154 l20 16.40 0.645 l 3 02 8 . 9 0 1.1 3 7 ? p 3 .75 3 . 8 5 0.147 0.151 q2.65 2. 9 5 0.104 0.116
package mechanical data stb/d/f/p/u3n62k3 12/19 dim. mm. inch min. typ max. min. typ. max. a 4.40 4.60 0.17 3 0.1 8 1 b 2.5 2.7 0.0 98 0.106 d 2.5 2.75 0.0 98 0.10 8 e 0.45 0.70 0.017 0.027 f 0.75 1.00 0.0 3 00.0 39 f1 1.15 1.50 0.045 0.067 f2 1.15 1.50 0.045 0.067 g4. 9 55.200.1 9 50.204 g1 2.40 2.70 0.0 9 4 0.106 h 10 10.40 0. 393 0.40 9 l2 16 0.6 3 0 l 3 2 8 .6 3 0.6 1.126 1.204 l4 9 . 8 0 10.60 0. 38 5 0.417 l5 2. 93 .6 0.114 0.141 l6 15. 9 0 16.40 0.626 0.645 l7 99 . 3 00. 3 54 0. 3 66 di a3 3 .2 0.11 8 0.126 to-220fp mechanical data l2 a b d e h g l6 f l3 g1 123 f2 f1 l7 l4 l5 7012510-i di a
stb/d/f/p/u3n62k3 package mechanical data 13/19 dim. mm. min. typ max. a 2.20 2.40 a1 0. 9 01.10 b 0.64 0. 9 0 b 2 0. 9 5 b 4 5.20 5.40 c 0.45 0.60 c2 0.4 8 0.60 d 6.00 6.20 e 6.40 6.60 e2.2 8 e1 4.40 4.60 h 16.10 l 9 .00 9 .40 (l1) 0. 8 01.20 l2 0. 8 0 v1 10 o to-251 (ipak) mechanical data 006 8 771_h
package mechanical data stb/d/f/p/u3n62k3 14/19 dim. mm. min. typ max. a 2.20 2.40 a1 0. 9 01.10 a2 0.0 3 0.2 3 b 0.64 0. 9 0 b 4 5.20 5.40 c 0.45 0.60 c2 0.4 8 0.60 d 6.00 6.20 d1 5.10 e 6.40 6.60 e1 4.70 e2.2 8 e1 4.40 4.60 h 9 . 3 5 10.10 l1 l1 2. 8 0 l2 0. 8 0 l4 0.60 1 r0.20 v2 0 o 8 o to-252 (dpak) mechanical data 006 8 772_g
stb/d/f/p/u3n62k3 package mechanical data 15/19 d2pak (to-263) mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 a1 0.0 3 0.2 3 0.001 0.00 9 b 0.70 0. 93 0.027 0.0 3 7 b 2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.2 3 1. 3 60.04 8 0.05 3 d 8 . 9 5 9 . 3 50. 3 52 0. 3 6 8 d1 7.50 0.2 9 5 e 10 10.40 0. 39 40.40 9 e1 8 .50 0. 33 4 e 2.54 0.1 e1 4. 88 5.2 8 0.1 9 20.20 8 h15 15. 8 50.5 9 00.624 j1 2.4 9 2.6 9 0.0 99 0.106 l2.2 9 2.7 9 0.0 9 0 0.110 l1 1.27 1.40 0.05 0.055 l2 1. 3 0 1.75 0.051 0.06 9 r 0.4 0.016 v2 0 8 0 8 0079457_m
package mechanical data stb/d/f/p/u3n62k3 16/19 5 package mechanical data tape and reel shipment dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 2500 2500 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters
stb/d/f/p/u3n62k3 package mechanical data 17/19 tape and reel shipment d 2 pak footprint * on sales type dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.039 n 100 3.937 t 30.4 1.197 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.413 0.421 b0 15.7 15.9 0.618 0.626 d 1.5 1.6 0.059 0.063 d1 1.59 1.61 0.062 0.063 e 1.65 1.85 0.065 0.073 f 11.4 11.6 0.449 0.456 k0 4.8 5.0 0.189 0.197 p0 3.9 4.1 0.153 0.161 p1 11.9 12.1 0.468 0.476 p2 1.9 2.1 0.075 0.082 r 50 1.574 t 0.25 0.35 0.0098 0.0137 w 23.7 24.3 0.933 0.956 tape mechanical data
revision history stb/d/f/p/u3n62k3 18/19 6 revision history table 10. document revision history date revision changes 10-jul-2008 1 first release
stb/d/f/p/u3n62k3 19/19 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military , air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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